会议论文

Liu, Li

英文

2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)

2018

593-598

第十九届国际电子封装技术会议(ICEPT 2018)

第十九届国际电子封装技术会议(ICEPT 2018)论文集

2018-08-08

上海

Inst Microelectron Chinese Acad Sci

中国电子学会<&wdkj&>国际电气电子工程师协会<&wdkj&>中科院

345 E 47TH ST, NEW YORK, NY 10017 USA

IEEE

978-1-5386-6386-8

Hubei Provincial Natural Science Foundation of ChinaNational Natural Science Foundation of China (NSFC) [2018CFB212]; State Key Laboratory of Materials Processing and Die & Mould Technology in Huazhong University of Technology [P2018-018]

本校为第一且通讯机构

The transient liquid phase sintering (TLPS) can fabricate solder joints of a high-remelting point with a relatively low temperature and short joining time, which shows excellent application prospects in power electronics. In this work, different Ag/In mass ratios were used to prepare high temperature Ag-In solder joints successfully by TLPS. The effects of Ag/In ratio, peak temperature dwelling time and aging time on the interfacial microstructure, chemical composition and porosity of the solder joints were studied. It is found that these Ag-In solder joints were composed of three parts includ...